SolderStar to introduce its Automatic Profiling System at Productronica 2007
NEWS RELEASE
5th October 2007
SolderStar to introduce its Automatic Profiling System at Productronica 2007
SolderStar announces it will display its new automatic profiling system, the SolderStar APS at Productronica 2007 (Hall A5, stand 424).
The classical way to obtain a temperature profile is to attach thermocouple sensors to the PCB and record the temperature profile using a heat protected data logger which travels with the assembly through the process.
While this method works very well for initial machine setup it does not lend itself to ongoing process monitoring in high production, military or safety critical environments as it can only be deployed periodically.
Manufacturers are therefore faced with the less than ideal situation of having to manually take a ‘snapshot’ the process performance every few hours and assume that in between the process remains within specification.
The oven itself monitors and maintains the temperature of each zone. Unfortunately this measurement is made near to the heaters and does not closely reflect the temperature seen at product level which is a function of the machine convection performance.
SolderStar APS provides full-time reflow process monitoring and is able to calculate a thermal profile for every board produced. Individual sensor probes are permanently mounted along the length of the reflow oven to measure product level temperature.
This newly developed probe design allows for a smaller physical size which offers two significant advantages, fast response to changing oven loading, and the elimination of shadowing problems associated with components mounted close to the conveyor rails.
Product speed and position are monitored by way of high accuracy real-time speed monitoring instrumentation, board-in sensors and a new software algorithm, resulting in a ‘True Profile’ for every board processed.
Every second, a set of temperature readings are taken and a measurement of conveyor speed is made, PC software then automatically calculates all important process parameters and checks for values outside defined limits for the process.
On exit of the board from the machine, this information, along with a board ID, is stored in a process database for complete product traceability. Should the measured parameters drift outside process limits, then the system immediately stops further entry of boards into the machine via a standard SMEMA interface, and alerts line staff that remedial action is required.
Live process statistic graphs which include Process CPK allow the user to monitor process performance in real-time.
Available worldwide through a comprehensive network of agents and distributors, the SolderStar range of profiling tools are gaining increasing recognition across the world by process engineers, who are finding the tools indispensable for the accurate set-up of their electronics assembly process lines.
Last Updated: 05 October 2007