New thermal profiling system from SolderStar makes European debut
NEWS RELEASE
04th October 2007
New thermal profiling system from SolderStar makes European debut at Productronica, Munich 2007.
New from SolderStar at Productronica 2007 (Hall A5, stand 424) will be the latest evolution of the SolderStar PRO thermal profiling system, featuring a new ultra-miniature datalogger that will enhance the performance and capabilities of the SolderStar profiling range.
Measuring just 100mm x 50mm x 9mm, the smallest profiling datalogger in the industry, is designed to offer a flexible solution to reflow, wave and continuous profiling through its unique Smartlink connection system.
High speed USB connectivity is utilised for reduced data download times and to provide power to recharge the internal high temperature battery, all from one standard USB cable.
As part of a pass-through reflow profiling system, the datalogger attaches by way Solderstar’s unique Smartlink system to a range of adapters which provide between 6 and 16 measurement channels in a variety of configurations. The Smartlink system effectively future-proof the system by allowing the channel count to be upgraded in line with the growing complexity of current and future assemblies.
Protected by a new upgraded heatshield system, this new system makes light work of lead-free operation whilst maintaining the smallest footprint for carrier-free operation in restricted tunnel height machines and on tricky narrow PCB applications.
When fitted to the SolderStar WaveShuttle, the SolderStar PRO datalogger becomes a high-end wave solder analyser capable of accurate, repeatable analysis of the problematic wave solder process.
The WaveShuttle fixture is purpose-made for wave solder analysis to which the SolderStar PRO datalogger is attached, again by way of the Smartlink.
For this application, the datalogger monitors top and bottom preheat temperatures, solder pot temperatures and chip and main wave contact over multiple points through the wave. Along with dedicated wave solder PC software, the system offers users industry-leading automatic graphical process analysis and process SPC capabilities in an easy-to-use package.
Available through a comprehensive network of agents and distributors, the SolderStar range of profiling tools are gaining increasing recognition across the world by process engineers, who are finding the tools indispensable for the accurate set-up of their electronics assembly process lines.
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About SolderStar
Established in 2002, SolderStar is a specialist in the design, development and manufacture of specialist thermal profiling equipment for the lead-free electronics industry. Incorporating state-of-the-art technology and full lead-free compliance, SolderStar’s range of instruments and software tools offers leading-edge performance, functionality, heat-resistance and miniaturisation.
SolderStar satisfies all of today’s thermal process control needs, from full-feature high performance product profiling for reflow and wave solder processes, to fully integrated SPC capabilities for continuous quality and process control. Products are available individually or in packages that are tailor-made to suit the technical and budgetary requirements of all electronics manufacturers, whatever their size and needs and wherever they are in the world. For more information about SolderStar, visit the company’s website at www.solderstar.com.
Last Updated: 04 October 2007